장비 상세정보
| 웨이퍼 검사 장비 (Wafer Inspection) | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
|||||||||||||
| 장비설명 | 웨이퍼 Flatness, Dimension, Surface 품질 측정 | ||||||||||||
| 구성 및 성능 | • WAFER TYPE : MONO / MULTI CRYSTALLINE • WAFER SIZE 125x125mm / 156x156mm • U.P.H MAX. 3,200 WAFERS/Hr • WAFER BREAKAGE RATE ≤0.05% • GEOMETRY ±80um • RECTANGULARITY ±0.05° • CHIPPING ＞80x80um • STAIN ＞200x200um (CONTRAST 30 OVER) • MICRO CRACK GAP ＞3um • IMPURTY DIAMETER ＞ 100um (CONTRAST 30 OVER) • PIN HOLE DIAMETER ＞ 10um (CONTRAST 30 OVER) • THICKNESS - ANGE : 100~500um - ACCURACY : ±1.5 - REPEATABILITY : 3σ<3um • TTV RANGE : <100um - REPEATABILITY : 3σ<3um • WARPAGE RANGE : <100um - REPEATABILITY : 3σ<10um (THE SAME BELT RUNNING) • BOW RANGE : <100um - REPEATABILITY : 3σ<10um (THE SAME BELT RUNNING) • SAW MARK 10um(D) x 150um(W) - REPEATABILITY : 3σ<6um (THE SAME BELT RUNNING) |
||||||||||||
| 사용예 | 웨이퍼 Flatness, Dimension, Surface 품질 측정 | ||||||||||||
